Instrument/ServiceType:
Copper electroplating
Instrument Description:
Metalization process for thick copper deposition/coating.
Primary Contact:
Tzu-Min Ou
Email id: cnl@colorado.edu
Instrument Location:
Engineering Center, ECEE 271
Copper electroplating
Metalization process for thick copper deposition/coating.
Tzu-Min Ou
Email id: cnl@colorado.edu
Engineering Center, ECEE 271